Warmly celebrate Jiangsu Tongling Electric Co., Ltd. won the 2021 Solar Energy Cup "Most Innovative Technology Leading Enterprise" New Award!
2022-01-07
On January 6, 2022, the 2021 "Solar Energy Cup" New Year's Eve Sharing Conference and the 9th "Solar Energy Cup" Photovoltaic Industry Awards Ceremony, organized by Sobi Photovoltaic Network, were grandly held in Suzhou. The "Solar Energy Cup" started in 2012 and is one of the most anticipated industry selection activities in the photovoltaic industry.
Tongling Co., Ltd. won two awards, "Most Innovative Technology Leading Enterprise" and "Most Influential Photovoltaic Component Enterprise". The conference was attended by Mr. Li Qianjin, the company's president, and Mr. Zhang Daoyuan, the vice president.
Mr. Li Qianjin, President of Jiangsu Tongling Electric Appliance Co., Ltd., said, "Tongling has always been committed to technological innovation. Innovation is the inexhaustible driving force for enterprise development. Tongling people have also proven the leading level of Tongling's product technology through practical actions and innovative high-quality products. From the persistence of glue filled junction boxes, to the innovation of pre glue filled junction boxes, to the pioneering of three part junction boxes, to the invention of today's cast chip junction boxes, Tongling is step by step practicing the great journey of photovoltaic innovation and creation.
The company's casting chip junction box is a product launched by the company that directly implants automatic protection chips into the junction box through low-voltage packaging technology, without the need for diode assembly in the future.
The "chip" used in the company's chip junction box is a Schottky diode chip, which belongs to the category of power semiconductor discrete device chips.
Product advantages
Less damage, more reliable. The chip junction box is integrated through low-voltage packaging technology, gradually releasing external stress during the curing process. The chip experiences less external stress and only goes through one processing step, avoiding the impact of jet on the chip and structural components during high-pressure injection molding. This reduces the stress caused by the expansion of the frame material, resulting in low mechanical damage to the chip and ensuring its yield and reliability.
High heat dissipation, high current. The chips in the chip junction box are directly integrated with the junction box. By independently packaging the chips, more flexible and targeted design and development can be carried out during the chip packaging process, such as filling thermal conductive media such as aluminum oxide powder and silicon micro powder in liquid epoxy resin to enhance the heat dissipation ability of the chips. This allows a single chip to carry larger currents, effectively controlling costs while improving performance.
Chip junction boxes not only require the company to accumulate long-term technology and experience to master the corresponding chip packaging technology, but also need to be combined with junction box assembly technology for application optimization, in order to achieve the performance requirements of junction box products and ensure the stability of quality.
In terms of core technology protection, the company has obtained two invention patents related to chip junction boxes and actively promoted its PCT international patent application work. As of now, it has obtained a Japanese patent license (Patent No. 6876142) and has entered the review stage in major countries such as the United States and Europe.
In summary, the company's chip junction box has good performance and leading technology. Currently, there is no product in the industry that is the same as the company's "chip junction box". Since 2018, the sales of the company's chip junction box have continued to increase, accounting for 12.45% of the junction box's operating income in the first half of 2021, up from 0.32% in 2018. Major customers such as Hanhua New Energy, REC, Trina Solar, Daycare, and Huilun have all purchased chip products. The chip junction box is expected to gain a larger market share, and its gross profit margin is also higher than traditional diode products, which will further promote the company's market competitiveness and profitability.
Jiangsu Tongling Electric Co., Ltd. is a professional manufacturer of solar photovoltaic module connection systems. The main products include solar photovoltaic module junction boxes, connectors, solder strips, photovoltaic cables, wire harnesses, and other finished products and accessories for solar photovoltaic module connection systems.
The company's excellent product quality and excellent after-sales service have created brand advantages for the enterprise. It has successively won titles such as "Top 30 Enterprises in Yangzhong City", "High tech Enterprise", "China Famous Trademark", "Contract abiding and Creditworthy Enterprise", "AAA Credit Enterprise", and "Civilized Unit" at the provincial, municipal, and municipal levels, and has been awarded the Yangzhong City Quality Award.
The company's products have won the "High tech Products", "Jiangsu Famous Brand Products", and "Jiangsu Patent New Product Gold Award" respectively, and have passed certifications such as Golden Sun CGC, CQC, TUV Rheinland, TUV Sud, UL, VDE, ROHS, CE, JET, etc.
Today's Tongling Co., Ltd. continues to pursue the corporate spirit of "integrity-based and moving customers", adhering to the purpose of "winning with quality and striving for excellence", based on independent innovation, and moving towards the grand goal of "branding and internationalization".